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| NLX3G14 Triple Schmitt-Trigger Inverter The NLX3G14 MiniGatet is an advanced high-speed CMOS triple Schmitt-trigger inverter in ultra-small footprint. The NLX3G14 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. The NLX3G14 can be used to enhance noise immunity or to square up slowly changing waveforms. Features http://onsemi.com MARKING DIAGRAMS ULLGA8 1.45 x 1.0 CASE 613AA FM * * * * * * * Designed for 1.65 V to 5.5 V VCC Operation Low Power Dissipation: ICC = 1 mA (Max) at TA = 25C 24 Balanced Output Source and Sink Capability Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra-Small Packages These are Pb-Free Devices 1 1 ULLGA8 1.6 x 1.0 CASE 613AB ACM G 1 IN A1 1 8 VCC ULLGA8 1.95 x 1.0 CASE 613AC ACM G OUT Y3 2 7 OUT Y1 F or AC = Specific Device Code M = Date Code G = Pb-Free Package IN A2 3 6 IN A3 PIN ASSIGNMENT 1 2 3 4 5 6 IN A1 OUT Y3 IN A2 GND OUT Y2 IN A3 OUT Y1 VCC GND 4 5 OUT Y2 Figure 1. Pinout (Top View) 1 1 1 IN A1 IN A2 IN A3 OUT Y1 OUT Y2 OUT Y3 7 8 FUNCTION TABLE A L H Y H L Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2008 November, 2008 - Rev. 0 1 Publication Order Number: NLX3G14/D NLX3G14 MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IO ICC IGND TSTG TL TJ MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Moisture Sensitivity Flammability Rating Oxygen ESD Withstand Voltage Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) VIN < GND VOUT < GND Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -50 50 50 100 100 -65 to +150 260 150 Level 1 UL 94 V-0 @ 0.125 in > 2000 > 200 N/A 500 V Unit V V V mA mA mA mA mA C C C ILATCHUP Latchup Performance Above VCC and Below GND at 125C (Note 5) mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22-A114-A. 3. Tested to EIA / JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA Dt/DV Positive DC Supply Voltage Digital Input Voltage Output Voltage Operating Free-Air Temperature Input Transition Rise or Fall Rate VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V Parameter Min 1.65 0 0 -55 0 0 0 Max 5.5 5.5 5.5 +125 No Limit No Limit No Limit Unit V V V C ns/V http://onsemi.com 2 NLX3G14 DC ELECTRICAL CHARACTERISTICS VCC (V) 1.65 2.3 2.7 3.0 3.0 4.5 1.65 2.3 2.7 3.0 3.0 4.5 1.65 2.3 2.7 3.0 3.0 4.5 VIN v VT-MIN IOH = -100 mA VIN v VT-MIN IOH = -4 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA VIN w VT+MAX IOL = 100 mA VIN w VT+MAX IOH = 4 mA IOH = 8 mA IOH = 12 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA 0 v VIN v 5.5 V 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 0 to 5.5 0 TA = 25 5C Min 0.6 1.0 1.2 1.3 1.9 2.2 0.2 0.4 0.5 0.6 1.0 1.2 0.1 0.25 0.3 0.4 0.6 0.7 VCC - 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Typ 1.0 1.5 1.7 1.9 2.7 3.3 0.5 0.75 0.87 1.0 1.5 1.9 0.48 0.75 0.83 0.93 1.2 1.4 VCC Max 1.4 1.8 2.0 2.2 3.1 3.6 0.8 1.15 1.4 1.5 2.0 2.3 0.9 1.1 1.15 1.2 1.5 1.7 TA = +855C Min 0.6 1.0 1.2 1.3 1.9 2.2 0.2 0.4 0.5 0.6 1.0 1.2 0.1 0.25 0.3 0.4 0.6 0.7 VCC - 0.1 1.29 1.9 2.2 2.4 2.3 3.8 0.1 0.1 Max 1.4 1.8 2.0 2.2 3.1 3.6 0.8 1.15 1.4 1.5 2.0 2.3 0.9 1.1 1.15 1.2 1.5 1.7 TA = -555C to +1255C Min 0.6 1.0 1.2 1.3 1.9 2.2 0.2 0.4 0.5 0.6 1.0 1.2 0.1 0.25 0.3 0.4 0.6 0.7 VCC - 0.1 1.29 1.8 2.1 2.3 2.2 3.7 0.1 V Max 1.4 1.8 2.0 2.2 3.1 3.6 0.8 1.15 1.4 1.5 2.0 2.3 0.9 1.1 1.15 1.2 1.5 1.7 Unit V Symbol VT+ Parameter Positive Threshold Voltage Conditions VT- Negative Threshold Voltage V VH Hysteresis Voltage V VOH Minimum High-Level Output Voltage V 1.52 2.1 2.4 2.7 2.5 4.0 0 VOL Maximum Low-Level Output Voltage 0.08 0.2 0.22 0.28 0.38 0.42 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 1.0 0.24 0.4 0.5 0.5 0.55 0.65 1.0 mA IIN Input Leakage Current Power-Off Output Leakage Current Quiescent Supply Current IOFF VOUT = 5.5 V 1.0 10 10 mA ICC 0 v VIN v VCC 5.5 1.0 10 10 mA http://onsemi.com 3 NLX3G14 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) VCC (V) 2.3-2.7 3.0-3.6 Test Condition RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 4.5-5.5 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF CIN CPD Input Capacitance Power Dissipation Capacitance (Note 6) 5.5 3.3 5.5 VIN = 0 V or VCC 10 MHz VIN = 0 V or VCC TA = 25 5C Min 1.8 1.5 1.8 1.0 1.2 Typ 4.3 3.3 4.0 2.7 3.2 2.5 11 12.5 Max 7.4 5.0 6.0 4.1 4.9 TA = +855C Min 1.8 1.5 1.8 1.0 1.2 Max 8.1 5.5 6.6 4.5 5.4 TA = -555C to +1255C Min 1.8 1.5 1.8 1.0 1.2 Max 9.1 6.5 7.6 5.5 6.4 pF pF Unit ns Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD * VCC * fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD * VCC2 * fin + ICC * VCC. A or B VCC 50% tPLH Y 50% VCC tPHL GND Figure 3. Switching Waveforms VCC PULSE GENERATOR RT DUT CL RL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 4 NLX3G14 4 VT, TYPICAL INPUT THRESHOLD VOLTAGE (V) 3 2 VHtyp 1 2 2.5 3 3.5 3.6 VCC, POWER SUPPLY VOLTAGE (V) VHtyp = (VT + typ) - (VT - typ) Figure 5. Typical Input Threshold, VT+, VT- versus Power Supply Voltage VH VIN VCC VT+ VT- GND VOH VIN VH VCC VT+ VT- GND VOH VOUT VOL Vout VOL (b) A Schmitt-Trigger Offers Maximum Noise Immunity (a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times Figure 6. Typical Schmitt-Trigger Applications ORDERING INFORMATION Device NLX3G14AMX1TCG NLX3G14BMX1TCG NLX3G14CMX1TCG Package ULLGA8, 1.95 x 1.0, 0.5P (Pb-Free) ULLGA8, 1.6 x 1.0, 0.4P (Pb-Free) ULLGA8, 1.45 x 1.0, 0.35P (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NLX3G14 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA-01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 SEATING PLANE MILLIMETERS MIN MAX --- 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 PIN ONE REFERENCE 0.10 C 0.10 C 0.05 C 8X 0.05 C e/2 e 1 4 7X L1 1 PKG OUTLINE EEE EEE EEE 8 E TOP VIEW A SIDE VIEW A1 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* 0.48 7X 0.22 8X L NOTE 4 1.18 0.53 5 8X b 0.10 C A B 0.05 C NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLX3G14 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB-01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 SEATING PLANE MILLIMETERS MIN MAX --- 0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 PIN ONE REFERENCE 0.10 C 0.10 C 0.05 C 8X 0.05 C e/2 e 1 4 7X L1 1 PKG OUTLINE EEE EEE EEE 8 E TOP VIEW A SIDE VIEW A1 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* 0.49 7X 0.26 8X L NOTE 4 1.24 0.53 5 8X b 0.10 C A B 0.05 C NOTE 3 0.40 PITCH DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLX3G14 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC-01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 MILLIMETERS MIN MAX --- 0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 PIN ONE REFERENCE 0.10 C 0.10 C 0.05 C 8X 0.05 C L1 1 PKG OUTLINE MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EEEE EEEE EEEE e/2 1 8 E TOP VIEW A SIDE VIEW A1 C SEATING PLANE MOUNTING FOOTPRINT SOLDERMASK DEFINED* 0.49 7X 0.30 8X e 4 7X L NOTE 4 1.24 0.53 5 8X b 0.10 C A B 0.05 C NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NLX3G14/D |
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